Senior IC Package Design Engineer

4 days ago

Stockholm, Stockholm, Sweden Swedium Global Services Full time 900,000 - 1,200,000 per year

Swedium Global Services is the growing System Engineering and Solution Company, offers services like Semiconductor Engineering R&D Services, Embedded Systems Development, Custom Application Software Development, Web and Cloud Application Development, Testing Services, Consultancy and Outsourcing services to our clients across the globe for an onsite and offshore business model. Swedium Global is having presence in Sweden, Finland, Poland, Czech Republic and in India.

Job Name- Senior IC Package Design Engineer

Location-Onsite in Sweden

To strengthen our hardware development organization, we are looking for an experienced 
Xpedition Package Designer (xPD)
 who can drive package development for our custom ASICs and advanced semiconductor components.

Role Overview

As an Xpedition Package Designer, you will be responsible for designing complex semiconductor packages using Siemens Xpedition Package Designer (xPD). The role includes substrate design, bump/ball-map creation, stack-up definition, package-PCB co-design, and ensuring electrical, thermal and mechanical integrity of the final package.

You will work closely with ASIC designers, PCB engineers, SI/PI experts, mechanical teams, and external manufacturing partners.

Key Responsibility

  • Develop and optimize 
    2D/3D IC package designs
     using 
    Siemens Xpedition Package Designer (xPD)
    .
  • Create 
    ball maps, bump maps, wire-bond/flip-chip structures
    , and substrate routing.
  • Define 
    package stack-up
    , design rules, layer structures, and material selections.
  • Perform 
    package–PCB co-design
    , ensuring alignment with PCB guidelines and system constraints.
  • Collaborate with ASIC teams on 
    floorplanning, pad-ring constraints, power distribution
    , and thermal strategies.
  • Work with SI/PI engineers to support 
    signal integrity, power integrity, and impedance control requirements
    .
  • Prepare manufacturing documentation: 
    Gerbers, ODB++, IPC-2581, bonding diagrams, assembly drawings
    .
  • Drive DFM/DFT discussions with OSAT suppliers, ensuring manufacturability and cost efficiency.
  • Support failure analysis, package reliability reviews, and implement corrective design improvements.
  • Contribute to internal standards for package design workflows, templates, and design rule libraries.

Required Skillset

  • 5–12 years of experience in 
    IC package design
     using 
    Siemens Xpedition Package Designer (xPD)
     or equivalent (Mentor Expedition, Cadence APD/SIP).
  • Strong expertise in 
    substrate layout
    , 
    flip-chip designs
    , 
    wire-bond packages
    , and 
    high-speed interfaces
     (PCIe, DDR, CSI, etc.).
  • Solid understanding of 
    SI/PI fundamentals
    , impedance control, return-path integrity, and decoupling strategies.
  • Experience with package-PCB co-design and system-level constraints.
  • Hands-on experience with fabrication processes: 
    substrate manufacturing, assembly, bumping, underfill, molding
    .
  • Familiarity with 
    design rule creation
    , library management, and version control systems.
  • Ability to interpret ASIC pinouts, mechanical constraints, thermal simulations, and manufacturing feedback.

Good to Have

  • Experience working with OSATs (Amkor, ASE, JCET, SPIL, etc.).
  • Knowledge of 
    3D IC
    , 
    SiP
    , PoP, or stacked die architectures
  • Experience with scripting (Tcl, Python) for design automation.

Education

  • Bachelor's or Master's degree in Electrical Engineering, Electronics, Microelectronics, or a related discipline.

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